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ADA4692-2ACPZ-R7 Datasheet(PDF) 17 Page - Analog Devices

No. de pieza ADA4692-2ACPZ-R7
Descripción Electrónicos  Low Power, 3.6 MHz, Low Noise, Rail-to-Rail Output, Operational Amplifiers
PDF  19 Pages
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADA4692-2ACPZ-R7 Datasheet(HTML) 17 Page - Analog Devices

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Data Sheet
ADA4691-2/ADA4691-4/ADA4692-2/ADA4692-4
Rev. E | Page 17 of 19
OUTLINE DIMENSIONS
1
BOTTOM VIEW
TOP VIEW
16
5
8
9
12
13
4
0.20 REF
0.20 MIN
SIDE VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1.75
1.60 SQ
1.45
3.10
3.00 SQ
2.90
0.50
0.40
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.30
0.23
0.18
0.80
0.75
0.70
SEATING
PLANE
EXPOSED
PAD
P IN 1
IN D IC AT O R AR E A OP T IO N S
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
PIN 1
INDICATOR
AREA
0.50
BSC
COMPLIANT
TO JEDEC STANDARDS MO-220-WEED-6
Figure 62. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-22)
Dimensions shown in millimeters
BALL A1
IDENTIFIER
1.260
1.220
1.180
1.250
1.210
1.170
0.415
0.400
0.385
A
B
C
0.645
0.600
0.555
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
END VIEW
0.287
0.267
0.247
0.80
REF
0.40
BSC
SEATING
PLANE
0.230
0.200
0.170
COPLANARITY
0.05
Figure 63. 9-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-9-3)
Dimensions shown in millimeters



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