NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

PACKAGE OUTLINE

4224636/A 11/2018

www.ti.com

WQFN - 0.8 mm max height

PLASTIC QUAD FLAT PACK-NO LEAD

BQA0014A

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

2.6

2.4

3.1

2.9

PIN 1 INDEX AREA

0.8

0.7

0.05

0.00

SEATING PLANE

C

1.1

0.9

1.6

1.4

2X 0.5

2X

2

8X 0.5

14X 0.3

0.2

14X 0.5

0.3

(0.2) TYP

2

6

7

8

9

13

14

1

15

PIN 1 ID

(OPTIONAL)