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STM32F732IE Datasheet(PDF) 219 Page - STMicroelectronics |
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STM32F732IE Datasheet(HTML) 219 Page - STMicroelectronics |
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219 / 226 page ![]() DS11854 Rev 6 219/226 STM32F732xx STM32F733xx Package information 222 Figure 97. WLCSP100 - Recommended footprint Table 123. WLCSP100 - Mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to the 4rd decimal place. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2(2) 2. Back side coating. - 0.380 - - 0.0150 - A3 - 0.025(3) 3. Nominal dimension rounded to the 3rd decimal place results from process capability. - - 0.0010 - b 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 4.306 4.341 4.376 0.1695 0.1709 0.1723 E 4.740 4.775 4.810 0.1866 0.1880 0.1894 e - 0.400 - - 0.0157 - e1 - 3.600 - - 0.1417 - e2 - 3.600 - - 0.1417 - F(4) 4. Calculated dimensions are rounded to 3rd decimal place. - 0.3705 - - 0.0146 - G(4) - 0.5875 - - 0.0231 - N100 aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 BGA_WLCSP_FT_V1 Dsm Dpad |
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