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2021 Microchip Technology Inc. and its subsidiaries

DS20006508B-page 17

SY75602A/02B/603A/03B/604A/04B

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pitch

MILLIMETERS

0.40 BSC

MIN

E

MAX

Contact Pad Length (Xnn)

Contact Pad Width (Xnn)

Y

X

0.85

0.20

NOM

C

Contact Pad Spacing

1.30

Contact Pad to Contact Pad (Xnn)

G

0.45

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-27509 Rev A

C

X

Y

G

E

SILK SCREEN

12

8

8-Lead Very Thin Dual Flat, No Lead Package (NNC) - 1.6x1.4x0.9 mm Body [VDFN]

With Stepped Wettable Flanks