EDB8164B4PR-1DITF-R datasheet(152/152 Pages) MICRON

152 / 152 page

Revision History

Rev. F – 08/16

• Updated legal status to Production

• Removed "Embedded" from title

• Corrected Revision information in Options

Rev. E – 05/16

• Updated IDD table

Rev. D – 03/16

• Updated Ballout Diagrams for 216-Ball Dual-Channel FBGA – 2 x 4Gb Die and 4 x 4Gb

Die to match Ball Description table

Rev. C – 02/16

• Preliminary DDP release

Rev. B – 01/15

• Added 220-ball ballout and a 14x14 package

Rev. A – 09/14

• Initial release created from the 216b_2c0e_2channel Rev. A data sheet

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000

www.micron.com/products/support Sales inquiries: 800-932-4992

Micron and the Micron logo are trademarks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.

Although considered final, these specifications are subject to change, as further product development and data characterization some-

times occur.

216-Ball and 220-Ball, Dual-Channel LPDDR2 SDRAM

Revision History

09005aef85eb530a

216b_220b_2ch_2e0e_embedded_lpddr2.pdf – Rev. F 08 /16 EN

152

Micron Technology, Inc. reserves the right to change products or specifications without notice.

EDB8164B4PR-1DITF-R Datasheet(PDF) 152 Page - Micron Technology