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LM75BDP Datasheet(PDF) 24 Page - NXP Semiconductors |
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LM75BDP Datasheet(HTML) 24 Page - NXP Semiconductors |
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24 / 37 page ![]() LM75B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2015. All rights reserved. Product data sheet Rev. 6.1 — 6 February 2015 24 of 37 NXP Semiconductors LM75B Digital temperature sensor and thermal watchdog Fig 22. Package outline SOT505-1 (TSSOP8) UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.70 0.35 6 ° 0 ° 0.1 0.1 0.1 0.94 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.4 SOT505-1 99-04-09 03-02-18 w M bp D Z e 0.25 14 8 5 θ A A2 A1 Lp (A3) detail X L HE E c v M A X A y 2.5 5 mm 0 scale TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 1.1 pin 1 index |
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