7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

–VS, +VS pins voltage

± 20

V

40

IN pins voltage

V

RG, REF, OUT pins voltage

V

RG pins current

–10

10

mA

OUT pin current

–50

50

mA

Output short-circuit current(2)

Continuous

Operating temperature

–50

150

°C

Junction temperature

175

°C

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2.7

36

V

±1.35

±18

Specified temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

INA823

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

126.7

167.5

°C/W

Junction-to-case (top) thermal resistance

67.0

60.3

°C/W

Junction-to-board thermal resistance

70.1

88.7

°C/W

Junction-to-top characterization parameter

18.6

7.9

°C/W

Junction-to-board characterization parameter

69.4

87.1

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA823

SBOSA75A – JULY 2021 – REVISED JULY 2021

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