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DA9131 Datasheet(PDF) 11 Page - Dialog Semiconductor |
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DA9131 Datasheet(HTML) 11 Page - Dialog Semiconductor |
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11 / 56 page ![]() DA9131 High-Performance, Dual-Channel DC-DC Converter for Mobile and Portable Applications Datasheet Revision 2.0 11-Aug-2021 CFR0011-120-00 11 of 56 © 2021 Dialog Semiconductor 3.3 Thermal Characteristics 3.3.1 Thermal Ratings Table 5: Package Ratings Parameter Description Conditions Min Typ Max Unit JA Package thermal resistance 21.21 Note 1 °C/W Note 1 Obtained from package thermal simulations, JEDEC 2S2P four layer board (76.2 mm x 114 mm x 1.6 mm), 70 μm (2 oz) copper thickness power planes, 35 μm (1 oz) copper thickness signal layer traces, natural convection (still air), see Section 6.1. 3.3.2 Power Dissipation Table 6: Power Dissipation Parameter Description Conditions Min Typ Max Unit PD_Twarn Power dissipation @105 °C ambient, TJ_WARN 0.94 W PD_Tcrit Power dissipation @105 °C ambient, TCRIT 1.65 W Figure 5: Power Derating Curve 3.4 ESD Characteristics Table 7: ESD Characteristics Parameter Description Conditions Min Typ Max Unit VESD_HBM ESD protection, human body model (HBM) 2 kV |
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