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MCP3464 Datasheet(PDF) 98 Page - Microchip Technology

No. de pieza MCP3464
Descripción Electrónicos  Two/Four/Eight-Channel, 153.6 ksps, Low Noise, 16-Bit Delta-Sigma ADC
PDF  108 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP3464 Datasheet(HTML) 98 Page - Microchip Technology

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MCP3461/2/4
DS20006180D-page 98
 2019-2021 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
1.80
1.80
MILLIMETERS
0.40 BSC
MIN
E
MAX
3.00
Contact Pad Length (X20)
Contact Pad Width (X20)
Y1
X1
0.80
0.20
Microchip Technology Drawing C04-2264A
NOM
SILK SCREEN
1
2
20
C1
C2
E
X1
Y1
G1
Y2
X2
C1
Contact Pad Spacing
3.00
Contact Pad to Center Pad (X20)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
ØV
EV
EV
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package
- 3x3 mm Body [UQFN]
(Formerly Q3DE; SST Legacy Package)



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