eGaN® FET DATASHEET

EPC2015C

EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2021 |

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RECOMMENDED

LAND PATTERN

(measurements in µm)

Pad no. 1 is Gate;

Pads no. 3, 5, 7, 9, 11 are Drain;

Pads no. 4, 6, 8, 10 are Source;

Pad no. 2 is Substrate.*

*Substrate pin should be connected to Source

The land pattern is solder mask defined.

RECOMMENDED

STENCIL DRAWING

(units in µm)

Recommended stencil should be 4 mil (100 μm)

thick, must be laser cut , opening per drawing.

The corner has a radius of R60.

Intended for use with SAC305 Type 3 solder,

reference 88.5% metals content.

Additional assembly resources available at

http://epc-co.com/epc/DesignSupport/

AssemblyBasics.aspx

3

4

5

7

6

9

8

10

11

x9

1

2

400

4105

400

x8

180

180

Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to

improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights, nor the rights of others.

eGaN® is a registered trademark of Efficient Power Conversion Corporation.

EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx

DIE OUTLINE

Solder Bar View

Side View

Pad no. 1 is Gate;

Pads no. 3, 5, 7, 9, 11 are Drain;

Pads no. 4, 6, 8, 10 are Source;

*Substrate pin should be connected to Source

DIM

MICROMETERS

MIN

Nominal

MAX

A

4075

4105

4135

B

1602

1635

1662

c

1379

1382

1385

d

577

580

583

e

235

250

265

f

195

200

205

g

400

400

400

A

e

g

3

4

5

7

6

9

8

10

11

g

x8

f

f

x9

2

1

Seating Plane

3

4

5

7

6

9

8

10

11

x9

1

2

400

4105

400

x8

180

180

R60

Information subject to

change without notice.

Revised April, 2021