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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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PESD1663U005 Datasheet(PDF) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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PESD1663U005 Datasheet(HTML) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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4 / 7 page  12 Soldering Parameters Profile Feature Pb-Free Assembly Pre Heat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (ts) from (Tsmin to Tsmax) 150 °C 200 °C 60-120 seconds Ramp-up Rate (TL to Tp) 3 °C/second max. Liquidus temperature (TL) Time (tL) maintained above TL 217 °C 60-150 seconds Peak package body temperature (Tp) 260+0/-5 °C Time (tp)* within 5 °C of the specified classification temperature (Tc) 30* seconds Ramp-down Rate (Tp to TL) 6 °C/second max. Time 25 °C to peak temperature 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. PESD1663U005 Rev : www.leiditech.com 01.06.2015 4/7 |
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