ADPA7008CHIP datasheet(26/26 Pages) AD

No. de pieza	ADPA7008CHIP

Descripción Electrónicos	20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 31 dBm (1 W) Power Amplifier

PDF	26 Pages

Scroll/Zoom	100%

Fabricante Electrónico	AD [Analog Devices]

Página de inicio	http://www.analog.com

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ADPA7008CHIP

Data Sheet

Rev. 0 | Page 26 of 26

OUTLINE DIMENSIONS

3.610 SQ

*This die utilizes fragile air bridges. Any pickup tools used must not contact this area.

TOP VIEW

(CIRCUIT SIDE)

SIDE VIEW

1.194

0.888

0.08

0.126

0.642

0.787

0.770

0.624

0.888

1.068

3.270

0.260

*AIR BRIDGE

AREA

0.102

0.130

0.174

0.197

1.532

3.355

0.668

0.938

1.595

1.598

0.110

0.101

(Pads 2 - 4)

0.125

0.095 × 0.145

(Pads 1 and 6)

0.145 × 0.095

(Pads 4 and 8)

0.095 × 0.095

(Pads 2, 3, 5, 7, 9, 10)

0.101

(Pads 8 - 10)

0.117

(Pads 5 - 7)

Figure 68. 10-Pad Bare Die [CHIP]

(C-10-12)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

Temperature Range

Package Description

Package Option

ADPA7008CHIP

−55°C to +85°C

10-Pad Bare Die [CHIP]

C-10-12

ADPA7008C-KIT

−55°C to +85°C

10-Pad Bare Die [CHIP]

C-10-12

1 The ADPA7008CHIP and ADPA7008C-KIT are RoHS compliant parts.

2 Die inspected to meet MIL-STD-883 Method 2010, Condition B.

registered trademarks are the property of their respective owners.

D25395-3/21(0)

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