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74HC08 Datasheet(PDF) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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74HC08 Datasheet(HTML) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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2 / 15 page ![]() 4 Functional diagram mna222 1A 1B 1Y 2 1 3 2A 2B 2Y 5 4 6 3A 3B 3Y 10 9 8 4A 4B 4Y 13 12 11 Figure 1. Logic symbol mna223 3 & & & & 2 1 6 5 4 8 10 9 11 13 12 Figure 2. IEC logic symbol mna221 A B Y Figure 3. IEC logic symbol 5 Pinning information 5.1 Pinning 1A VCC 1B 4B 1Y 4A 2A 4Y 2B 3B 2Y 3A GND 3Y 1 2 3 4 5 6 7 8 10 9 12 11 14 13 74HC08 74HCT08 aaa-004035 Figure 4. Pin configuration SO14 and (T)SSOP14 GND(1) Transparent top view 2Y 3A 2B 3B 2A 4Y 1Y 4A 1B 4B 6 9 5 10 4 11 3 12 2 13 terminal 1 index area 74HC08 74HCT08 aaa-004036 (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Figure 5. Pin configuration DHVQFN14 74HC08; 74HCT08 Rev : www.leiditech.com 01.06.2015 2/15 |
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