R0.00 January 9, 2020

www.seoulsemicon.com

Product Data Sheet

SWIXO7S0E

– WICOP

17

Handling of Silicone Resin for LEDs

(1) During processing, mechanical stress on the surface should be minimized as much as possible.

(2) Sharp objects of all types should not be used to pierce the sealing compound.

(3) When it is mounted WICOP on the PCB, material of the pick and place nozzle must be used soft

form in SMT.

(4) It must be choosing a pick and place nozzle which is smaller than the WICOP’s size.

(5) (2),(3) contents is necessary in SMT to prevent surface of WICOP

(6) In case WICOP is not recommended isopropyl alcohol and ultrasonic , solvent for cleaning .

Isopropyl alcohol and ultrasonic, solvent cleaning may cause damage to the WICOP

(7) If you want to be cleaning particle on surface of WICOP, Seoul semiconductors suggests using

cotton bud for cleaning after soldering of components

(8) Avoid leaving fingerprints on silicone resin parts.