STM32G474PBY3TR datasheet(227/236 Pages) STMICROELECTRONICS

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DS12288 Rev 5

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Table 121. UFBGA121 - mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

A(2)

2. - UFBGA stands for Ultra-Thin Profile Fine Pitch Ball Grid Array.

- Ultra Thin profile: 0.50 < A ≤ 0.65mm / Fine pitch: e < 1.00mm pitch.

- The total profile height (Dim A) is measured from the seating plane to the top of the component

- The maximum total package height is calculated by the following methodology:

A Max = A1 Typ + A2 Typ + A4 Typ + √ (A1²+A2²+A4² tolerance values)

0.60

0.0236

0.11

0.0043

0.13

0.0051

0.32

0.0126

b(3)

3. The typical balls diameters before mounting is 0.20 mm

0.24

0.29

0.34

0.0094

0.0114

0.0134

5.85

6.00

6.15

0.2303

0.2362

0.2421

5.00

0.1969

5.85

6.00

6.15

0.2303

0.2362

0.2421

5.00

0.1969

0.50

0.0197

0.50

0.0197

ddd

0.08

0.0031

eee(4)

4. The tolerance of position that controls the location of the pattern of balls with respect to datum A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true

position with respect

to datum A and B as defined by e. The axis perpendicular to datum C of each ball must lie within this

tolerance zone.

0.15

0.0059

fff(5)

5. The tolerance of position that controls the location of the balls within the matrix with respect to each other.

For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position

as defined by e. The axis perpendicular to datumC of each ball must lie within this tolerance zone.

Each tolerance zone fff in the array is contained entirely in the respective zone eee above. The axis of each

ball must lie simultaneously in both tolerance zones.

0.05

0.0020

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