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STM32G474PBY3TR Datasheet(PDF) 201 Page - STMicroelectronics

No. de pieza STM32G474PBY3TR
Descripción Electrónicos  Arm® Cortex®-M4 32-bit MCUFPU, 170 MHz / 213 DMIPS, 128 KB SRAM, rich analog, math acc, 184 ps 12 chan Hi-res timer
PDF  236 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G474PBY3TR Datasheet(HTML) 201 Page - STMicroelectronics

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DS12288 Rev 5
201/236
STM32G474xB STM32G474xC STM32G474xE
Package information
232
6
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
6.1
WLCSP81 package information
WLCSP81 is a 81-ball, 4.02x4.27 mm, 0.4 mm pitch wafer level chip scale package.
Figure 54. WLCSP81 - outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
B068_WLCSP81_DIE469_ME_V1
1
9
e1
e2
e
J
A
F
G
D
E
A
A2
A1
bbb Z
A3
A2
A1 BALL
LOCATION
DETAIL A
b
ccc
ddd
M
Z
Z
X Y
M
b(81x)
SEATING PLANE
z
BUMP
DETAIL A
ROTATED 90
eee Z
TOP VIEW
BOTTOM VIEW
FRONT VIEW
SIDE VIEW
A1
eee
(4X)



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