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TL084MFKB Datasheet(PDF) 44 Page - Texas Instruments

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No. de pieza TL084MFKB
Descripción Electrónicos  TL08xx FET-Input Operational Amplifiers
PDF  66 Pages
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

TL084MFKB Datasheet(HTML) 44 Page - Texas Instruments

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Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TL084CDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TL084CDRG4
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TL084CNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
TL084CPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TL084HIDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TL084HIPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TL084IDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TL084QDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TL084QDRG4
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TL081ACDR
SOIC
D
8
2500
340.5
338.1
20.6
TL081BCDR
SOIC
D
8
2500
340.5
338.1
20.6
TL081CDR
SOIC
D
8
2500
340.5
338.1
20.6
TL081IDR
SOIC
D
8
2500
340.5
338.1
20.6
TL082ACDR
SOIC
D
8
2500
853.0
449.0
35.0
TL082ACDR
SOIC
D
8
2500
340.5
338.1
20.6
TL082BCDR
SOIC
D
8
2500
340.5
338.1
20.6
TL082CDR
SOIC
D
8
2500
853.0
449.0
35.0
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Dec-2020
Pack Materials-Page 2



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