Silicom Ltd. Connectivity Solutions

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PCI Express X8 lanes



Support PCI Express Base Specification 3.0 (8 GTs)

System Acceleration Throughput

INTEL® C628 CHIPSET/

INTEL® C627 CHIPSET

INTEL® C626 CHIPSET

INTEL® C625 CHIPSET

SSL/IPSec

54Gbps (PCIe BW)

40Gbps

20Gbps

Compression Deflate

54Gbps (PCIe BW)

40Gbps

20Gbps

Decompression Deflate

54Gbps (PCIe BW)

54Gbps (PCIe BW)

54Gbps (PCIe BW)

RSA Decrypt 1k-bit

550K Ops/sec

550K Ops/sec

550K Ops/sec

RSA Decrypt 2k-bit

100K Ops/Sec

40K Ops/Sec

20K Ops/Sec

TLS Handshakes ECDH_RSA2K

440K Ops/sec

TLS Handshakes EDHE+ECDSA 51K Ops/sec

SSL/IPSec + Compression +

PKE

Total 120 Gbps +

100K Ops/sec

Technical Specifications

General Technical Specifications:

Interface Standard:

PCI-Express Base Specification Revision 3.0 (8 GTs)

Board Size:

Low profile short add-

in card: 167.64 mm X 64.389mm (6.600”X 2.535”)

PCI Express Card Type:

X8 Lane

PCI Express Voltage

+12V ± 8%

+3.3V ± 9%

There will not be an external Aux power input.

PCI Connector:

Gold Finger: X8

Controllers:

Intel® C628 Chipset

Intel® C627 Chipset

Intel® C626 Chipset

Intel® C625 Chipset

Weight:

170 gr (6.0 oz)

Power Consumption:

PE3ISLBTL

– 16.33W

PE3ISLBML

– 6.97W