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MCP2517FD Datasheet(PDF) 89 Page - Microchip Technology

No. de pieza MCP2517FD
Descripción Electrónicos  External CAN FD Controller with SPI Interface
PDF  98 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP2517FD Datasheet(HTML) 89 Page - Microchip Technology

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 2017-2018 Microchip Technology Inc.
DS20005688B-page 89
MCP2517FD
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
4.25
1.65
MILLIMETERS
0.65 BSC
MIN
E
MAX
Contact Pad Length (X14)
Contact Pad Width (X14)
Y1
X1
0.85
0.35
Microchip Technology Drawing C04-3198A
NOM
12
14
C
Contact Pad Spacing
3.00
Contact Pad to Center Pad (X14)
G1
0.25
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
E
C
X2
Y2
EV
EV
ØV
X1
Y1
SILK SCREEN
14-Lead Very Thin Plastic Quad Flat, No Lead Package (JHA) - 4.5x3.0 mm Body
[VDFN] With Dimpled Wettable Flanks
G2
Spacing Between Contacts (X12)
G1
0.30
G1



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