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5000 Datasheet(PDF) 15 Page - Texas Instruments

No. de pieza 5000
Descripción Electrónicos  Tiva??C Series TM4C1294 Connected LaunchPad Evaluation Kit
PDF  42 Pages
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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5000 Datasheet(HTML) 15 Page - Texas Instruments

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Functional Description
15
SPMU365C – March 2014 – Revised October 2016
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Copyright © 2014–2016, Texas Instruments Incorporated
Hardware Description
2.1.6.3
Breadboard Connection
The breadboard adapter section of the board is a set of 98 holes on a 0.1 inch grid. Properly combined
with a pair of right angle headers, the entire Connected LaunchPad can be plugged directly into a
standard 300 mil (0.3 inch) wide solder-less breadboard. The right angle headers and breadboard are not
provided with this kit. Suggested part numbers are Samtec TSW-149-09-L-S-RE and TSW-149-08-L-S-RA
right angle pin headers and Twin industries TW-E40-1020 solder-less breadboard. Samtec TSW-149-09-
F-S-RE and TSW-149-09-F-S-RA may be substituted.
A detailed explanation of how to install the headers is available on the TI LaunchPad Wiki or at
http://users.ece.utexas.edu/~valvano/EE345L/Labs/Fall2011/LM3S1968soldering.pdf.
Nearly all microcontroller signals are made available at the breadboard adapter holes (X11). These signals
are grouped by function where possible. For example, all EPI signals are grouped on one side of the
connector. Many of the analog signals are grouped near VREF, and UART, SSI and I2C signals are
grouped by peripheral to make expansion and customization simpler.
Table 2-3 and Table 2-4 show the GPIO pin and signal muxing for the X11 breadboard adapter pads.



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