R200 datasheet(12/51 Pages) INTEL

No. de pieza	R200

Descripción Electrónicos	Embedded Infrared Assisted Stereovision 3D Imaging System with Color Camera

PDF	51 Pages

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Fabricante Electrónico	INTEL [Intel Corporation]

Página de inicio	http://www.intel.com

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Overview

334616-001

respective cable suppliers to manufacture a cable according to the guidance provided in this

document.

2.3

Components

Table 2-1. Component Descriptions

Acronym

Definition

Anti-Reflective (Coating)

ASIC

Application Specific Integrated Circuit

Baseline

Distance between Left and Right Infrared Imager

CMC

Common Mode Choke

EMI

Electromagnetic Interference

ESD

Electrostatic Discharge

FEA

Finite Element Analysis, a type of mechanical simulation

FHD

Full High Definition

FOP

Field of Projection (Horizontal/Vertical/Diagonal)

FOV

Field of View (Horizontal/Vertical/Diagonal)

GPIO

General Purpose Input/Output

Infrared

LED

Light Emitting Diode

PCB

Printed Circuit Board

R200

Intel® RealSense™ R200

RFI

Radio Frequency Interference

TBD

To Be Determined

TDP

Thermal Design Power

TIM

Thermal Interface Material

Component Junction Temperature

USB

Universal Serial Bus

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