MPX4100AS datasheet(9/13 Pages) NXP

No. de pieza	MPX4100AS

Descripción Electrónicos	Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated

PDF	13 Pages

Scroll/Zoom	100%

Fabricante Electrónico	NXP [NXP Semiconductors]

Página de inicio	http://www.nxp.com

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9 / 13 page

MPX4100A

Sensors

Freescale Semiconductor

Pressure

PACKAGE DIMENSIONS

PIN 1

6 PL

SEATING

PLANE

-T-

0.136 (0.005)

POSITIVE PRESSURE

(P1)

-A-

STYLE 1:

PIN 1. VOUT

2. GROUND

3. VCC

4. V1

5. V2

6. VEX

STYLE 3:

PIN 1. OPEN

2. GROUND

3. +VOUT

4. +VSUPPLY

5. -VOUT

6. OPEN

STYLE 2:

PIN 1. OPEN

2. GROUND

3. -VOUT

4. VSUPPLY

5. +VOUT

6. OPEN

MAX

MILLIMETERS

INCHES

16.00

13.56

5.59

0.84

1.63

0.100 BSC

2.54 BSC

0.40

18.42

30˚ NOM

12.57

11.43

DIM

MIN

0.595

0.514

0.200

0.027

0.048

0.014

0.695

0.475

0.430

0.090

MAX

0.630

0.534

0.220

0.033

0.064

0.016

0.725

0.495

0.450

0.105

MIN

15.11

13.06

5.08

0.68

1.22

0.36

17.65

12.07

10.92

2.29

2.66

NOTES:

DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

DIMENSION -A- IS INCLUSIVE OF THE MOLD

STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

CASE 867-08

ISSUE N

BASIC ELEMENT

MPX4100AS Datasheet(PDF) 9 Page - NXP Semiconductors

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