TMUX1237 datasheet(23/31 Pages) TI1

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Source or Drain Voltage (V)

0.5

1.5

2.5

3.5

4.5

VDD = 1.08V

VDD = 1.62 V

VDD = 3 V

VDD = 4.5 V

D001

TMUX1237

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SCDS424A – DECEMBER 2019 – REVISED MARCH 2020

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9.2.2.2 Detailed Design Procedure

The application shown in demonstrates how to use a single control input and toggle between gain settings of -1

and +1. If switching between inverting and unity gain is not required, the TMUX1237 can be utilized in the

feedback path to select different feedback resistors and provide scalable gain settings for configurable signal

conditioning.

The TMUX1237 can be operated without any external components except for the supply decoupling capacitors.

The select pin is recommended to have a pull-down or pull-up resistor to ensure the input is in a known state if

the control signal becomes disconnected. All inputs to the switch must fall within the recommend operating

conditions of the TMUX1237 including signal range and continuous current. For this design with a supply of 2.75

V the signal range can be 0 V to 2.75 V and the max continuous current can be 50 mA.

9.2.2.3 Application Curve

TA = 25°C

Figure 20. On-Resistance vs Source or Drain Voltage

10 Power Supply Recommendations

The TMUX1237 operates across a wide supply range of 1.08 V to 5.5 V. Do not exceed the absolute maximum

ratings because stresses beyond the listed ratings can cause permanent damage to the devices.

Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD supply to

other components. Good power-supply decoupling is important to achieve optimum performance. For improved

supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF from VDD to ground.

Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance

connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series

resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive

systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to

the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall

inductance and is beneficial for connections to ground planes.

TMUX1237 Datasheet(PDF) 23 Page - Texas Instruments