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SL2S2602FUD Datasheet(PDF) 8 Page - NXP Semiconductors |
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SL2S2602FUD Datasheet(HTML) 8 Page - NXP Semiconductors |
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8 / 55 page ![]() NXP Semiconductors SL2S2602 ICODE SLIX2 SL2S2602 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Product data sheet Rev. 4.1 — 25 July 2017 COMPANY PUBLIC 276341 8 / 55 7 Wafer Layout aaa-016465 GND LA LB TEST not to scale Figure 4. Wafer SL2S2602FUD/BG layout and pin configuration for the bare die 7.1 Pin Description Table 4. Bonding pad description Symbol Description LA antenna RF input LB antenna RF input GND ground TEST test input See Ref. 6 "General specification for 8" wafer on UV-tape with electronic fail die marking". |
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