TAI-TECH

P3

1

2

2

5. Specification

6. Material List

NO

Items

Materials

1

Core

Alloy powder.

2

Wire

Polyester Wire or equivalent.

3

Solder

100% Pb free solder

4

Ink

Halogen-free ketone

4

3

Part Number

Inductance

(uH) ±20%

@ 0 A

I rms(A) Typ

I sat(A)

DCR(mΩ)

Typ.

DCR(mΩ)

Max.

20℃ rise 40℃ rise

Typ

Max

TMPF0502A-R15MN-D

0.15

13.9

18.8

30.0

27.0

4.00

4.60

TMPF0502A-R33MN-D

0.33

10.5

14.4

26.0

24.0

6.10

7.00

TMPF0502A-R47MN-D

0.47

10.1

14.1

22.0

20.0

7.00

8.05

TMPF0502A-R56MN-D

0.56

9.9

13.9

19.0

16.0

8.70

9.54

TMPF0502A-R68MN-D

0.68

9.6

13.4

16.0

14.0

8.90

10.2

TMPF0502A-R80MN-D

0.80

9.4

13.0

15.5

13.5

10.3

11.8

TMPF0502A-R82MN-D

0.82

8.5

12.0

15.0

13.0

11.0

12.7

TMPF0502A-1R0MN-D

1.00

7.5

10.5

14.5

12.8

12.0

13.8

TMPF0502A-1R2MN-D

1.20

6.8

9.40

14.0

12.2

14.2

16.3

TMPF0502A-1R5MN-D

1.50

6.4

8.80

13.3

11.7

16.2

18.7

Note:

2. All test data referenced to 25℃ ambient.

3. Testing Instrument : L/Q: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU.

4. Current that causes the specified temperature rise from 25°C ambient.

6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

7. Special inquiries besides the above common used types can be met on your requirement.