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DSC6162JE1B-B Datasheet(PDF) 5 Page - Microchip Technology |
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DSC6162JE1B-B Datasheet(HTML) 5 Page - Microchip Technology |
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5 / 24 page ![]() 2019 Microchip Technology Inc. DS20006155A-page 5 DSC61XXB TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Operating Temperature TJ –40 — +150 °C — Storage Ambient Temperature Range TA –55 — +150 °C — Soldering Temperature TS — +260 — °C 40 sec. max. Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the max- imum allowable power dissipation will cause the device operating junction temperature to exceed the max- imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. |
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