DSC61XXB

DS20006155A-page 12

 2019 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

X2

Contact Width

Contact Pitch

MILLIMETERS

1.20 BSC

MIN

E1

MAX

Space Between Contacts (X4)

Contact Pad Length (X6)

G1

Y0.50

Microchip Technology Drawing C04-3199A

NOM

4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]

SILK SCREEN

12

4

X1

Contact Width (X3)

Space Between Contacts (X3)

G2

0.25

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

X1

Y

G2

(CH)

C

Contact Spacing

0.75

0.43

0.35

0.85

Contact 1 Index Chamfer

CH

0.13 X 45° REF

C

E2

Contact Pitch

1.16 BSC

E2

X2

G1

E1