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GD9FS1G6F2AMG Datasheet(PDF) 48 Page - GigaDevice Semiconductor (Beijing) Inc.

No. de pieza GD9FS1G6F2AMG
Descripción Electrónicos  Single level cell technology
PDF  55 Pages
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Fabricante Electrónico  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Página de inicio  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD9FS1G6F2AMG Datasheet(HTML) 48 Page - GigaDevice Semiconductor (Beijing) Inc.

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GD9Fx1GxF2A
48
Dimensions
Symbol
A
A1
A2
b
D
Hd
E
E1
e
L
L1
θ
Unit
mm
Min
-
0.05
0.90
0.14
18.30
19.80
11.90
-
0.50
0.425
0.60
0
Nom
-
0.10
1.00
0.22
18.40
20.00
12.00
-
0.525
0.80
-
Max
1.20
0.15
1.10
0.30
18.50
20.20
12.10
12.40
0.625
1.00
7
Note：
1.
Tolerance of the dimension should be ±0.1 unless otherwise specified.
2.
Corner radius should be less than ±0.1R unless otherwise specified (excluding outer lead).
3.
Tolerance of the angles should be ±0.5 degree unless otherwise specified.
4.
The mold surface should have a finish 8±2S without luster.
Trace of knockout pin and the ahaded portion of detail “A” should be polish surface.
5.
Discrepancies between upper and lower molding cavity should be less than 0.05 of the package.
6.
Mold flash should be less than 0.2mm.



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