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M50FLW080A Datasheet(PDF) 51 Page - STMicroelectronics

No. de pieza M50FLW080A
Descripción Electrónicos  8 Mbit (13 x 64KByte Blocks 3 x 16 x 4KByte Sectors), 3V Supply Firmware Hub / Low Pin Count Flash Memory
PDF  64 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M50FLW080A Datasheet(HTML) 51 Page - STMicroelectronics

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M50FLW080A, M50FLW080B
Part numbering
51/64
11
Part numbering
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc.) or for further information on any aspect
of this device, please contact the ST Sales Office nearest to you.
The category of second-Level Interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standard JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label.
Table 33.
Ordering information scheme
Example:
M50FLW080
A
K
5
T
G
Device Type
M50 = Flash Memory for PC BIOS
Architecture
FL = Firmware Hub/Low Pin Count Interface
Operating Voltage
W = VCC = 3.0 to 3.6V
Device Function
080 = 8 Mbit (x8), Uniform Blocks and Sectors
Array Matrix
A = 2 x 16 x 4KByte top sectors + 1 x 16 x 4KByte bottom sectors
B = 1 x 16 x 4KByte top sectors + 2 x 16 x 4KByte bottom sectors
Package
K = PLCC32
NB = TSOP32: 8 x 14mm(1)
1.
The TSOP32 package is only available in devices of the A type array matrix.
N = TSOP40: 10 x 20mm(2)
2.
Devices delivered in this package are Not Recommended for New Design.
Device Grade
5 = Temperature range –20 to 85 °C.
Device tested with standard test flow
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
P or G = ECOPACK® (RoHs compliant)



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