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BQ27Z561-R1

SLUSDH5 – MARCH 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input Voltage

BAT

–0.3

6

V

INT, PULS, CE

–0.3

6

V

SRP, SRN, BAT_SNS

–0.3

V

TS

–0.3

2.1

V

SCL, SDA/HDQ

–0.3

6

V

–40

85

°C

–40

125

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM) on all pins, per

±1500

V

Charged-device model (CDM) on all pins, per JEDEC

±500

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

No operating restrictions

2.0

5.5

V

External capacitor from BAT to

VSS

1

µF

Temperature sense

0

1.8

V

Input and output pins

0

V

Communication pins

0

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

7.4 Thermal Information

Over-operating free-air temperature range (unless otherwise noted)

BQ27Z561-R1

UNIT

DSBGA (YPH)

(12 PINS)

Junction-to-ambient thermal resistance

64.1

°C/W

Junction-to-case (top) thermal resistance

59.8

Junction-to-board thermal resistance

52.7

Junction-to-top characterization parameter

0.3

Junction-to-board characterization parameter

28.3

Junction-to-case (bottom) thermal resistance

2.4