Fully Automatic Polisher

DFP8141

Specifications

• Use clean, oil-free air at a dew point of -15°C or less. (Residual oil: 0.1 ppm. Filtration rating: 0.01 µm / 99.5% or more).

• Keep room temperature within ±1°C of the specified value. (Specified value should be between 20 – 25°C.)

• Keep grinding water 0 – 2°C above room temperature (fluctuations within 1°C over one hour).

• Keep spindle cooling water temperature between 20 and 25°C (fluctuations within 2°C over one hour).

• Machines should be used in an environment free from external vibration. Do not install machines near a ventilation opening, heat generating equipment, or oil mist generating parts.

• This machine uses water. Due to the risk of water leakage, please install the machine on a floor with sufficient waterproofing and drainage measures.

*All the pressures are described using gauge pressure.

*The above specifications may change due to technical modifications. Please confirm when placing your order.

*For further information please contact your local sales representatives.

2018.12

www.disco.co.jp

Specification

Unit

DFP8141

Wafer diameter

-

ø8”

Polishing method

-

CMP

Polishing wheel

mm

ø300 mm pad

Spindle

Rated output

kW

7.5

Revolution speed

min-1

500

– 2,000

Machine dimensions (W x D x H)

mm

900 x 2,584 x 2,000

Machine weight

kg

3,100