DFG8640

Fully Automatic Grinder

Pursuing high-precision grinding of various workpieces

Achieves high-precision grinding

High-precision grinding has been required for power devices and some

sensors because thickness variations between wafers and within one

wafer after grinding have an impact on product characteristics. The

DFG8640 achieves high-precision grinding through the optimization of the

processing point layout and installation of various mechanisms.

Available for various workpieces up to ø8 inches

DFG8640 is a fully automatic grinder installed with two spindles, three

chuck tables, and one turntable. This equipment supports various

workpieces up to ø8 inches, including Si (silicon), LiTaO3 (LT/lithium

tantalate), LiNbO3 (LN/lithium niobate), and SiC (silicon carbide).

Mechanisms for high-precision grinding

A spindle axis with high rigidity, low vibration, and less rotation speed fluctuation was

developed to achieve high-precision and high-quality processing. For the chuck table

axis, an air bearing unit with high rigidity, low vibration, low heat expansion, and less

rotation speed fluctuation has been installed.

Improved usability

The new GUI (graphical user interface), which enables intuitive operations such as

tapping and swiping in the same manner as smartphones and tablet devices, offers

quick operation from one screen to the target screen without going through other

screens.

Improved space productivity

The footprint is approx. 13% smaller than DFG8540. In addition, more than 1.2 times

as many wafers as DFG8540 can be transferred by reducing the cleaning mechanism

operation time and redesigning the transferring arm.

DFG8640

New GUI top screen

1,000 mm (W)

2,800 mm (D)

DFG8540

1,200 mm (W)

2,670 mm (D)

DFG8640