AD9735BBCZ datasheet(9/72 Pages) AD

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Data Sheet

AD9734/AD9735/AD9736

Rev. B | Page 9 of 72

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

With

Respect to

Min

Max

AVDD33

AVSS

−0.3 V

+3.6 V

DVDD33

DVSS

−0.3 V

+3.6 V

DVDD18

DVSS

−0.3 V

+1.98 V

CVDD18

CVSS

−0.3 V

+1.98 V

AVSS

DVSS

−0.3 V

+0.3 V

AVSS

CVSS

−0.3 V

+0.3 V

DVSS

CVSS

−0.3 V

+0.3 V

CLK+, CLK−

CVSS

−0.3 V

CVDD18 + 0.18 V

PIN_MODE

DVSS

−0.3 V

DVDD33 + 0.3 V

DATACLK_IN,

DATACLK_OUT

DVSS

−0.3 V

DVDD33 + 0.3 V

LVDS Data Inputs

DVSS

−0.3 V

DVDD33 + 0.3 V

IOUTA, IOUTB

AVSS

−1.0 V

AVDD33 + 0.3 V

I120, VREF, IPTAT

AVSS

−0.3 V

AVDD33 + 0.3 V

IRQ, CSB, SCLK, SDO,

SDIO, RESET

DVSS

−0.3 V

DVDD33 + 0.3 V

Junction Temperature

150°C

Storage Temperature

−65°C

+150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package Type

θJA1

Unit

160-Lead Ball, CSP_BGA

31.2

°C/W

1θJA measurement in still air.

ESD CAUTION

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