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AM652X Datasheet(PDF) 129 Page - Texas Instruments

No. de pieza AM652X
Descripción Electrónicos  Sitara Processors
PDF  299 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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AM652X Datasheet(HTML) 129 Page - Texas Instruments

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129
AM6548, AM6528, AM6546
AM6526, AM6527
www.ti.com
SPRSP08E – NOVEMBER 2017 – REVISED OCTOBER 2018
Submit Documentation Feedback
Product Folder Links: AM6548 AM6528 AM6546 AM6526 AM6527
Specifications
Copyright © 2017–2018, Texas Instruments Incorporated
Table 5-10. LVCMOS-FS Buffers DC Electrical Characteristics (continued)
over recommended operating conditions (unless otherwise noted)
PARAMETER
Test Conditions
MIN
TYP
MAX
UNIT
VIL
Low-level input threshold
0.55
V
VOH
High-level output threshold
IOH = 100 µA
VDDSHV0
- 0.2
V
VOL
Low-level output threshold
IOL = 100 µA
0.2
V
IIN
Input leakage current. This value represents
the maximum current flowing in or out of the
pin while the output driver is disabled and the
input is swept from VSS to VDD.
VI = VDDSHV0
45
µA
VI = VSS
1
µA
IOZ
Total leakage current through the
driver/receiver combination, which may
include an internal pull-up or pull-down. This
value represents the maximum current
flowing in or out of the pin while the output
driver is disabled, the pull-up or pull-down is
inhibited, and the input is swept from VSS to
VDD.
45
µA
5.7.1
USBHS Buffers DC Electrical Characteristics
NOTE
USB0 and USB1 Electrical Characteristics are compliant with Universal Serial Bus Revision
2.0 Specification dated April 27, 2000 including ECNs and Errata as applicable.
5.7.2
SERDES Buffers DC Electrical Characteristics
NOTE
The PCIe interfaces are compliant with the electrical parameters specified in PCI Express®
Base Specification Revision 4.0, February 19, 2014.
NOTE
USB0 instance is compliant with the USB3.1 SuperSpeed Transmitter and Receiver
Normative Electrical Parameters as defined in the Universal Serial Bus 3.1 Specification,
Revision 1.0, July 26, 2013.
5.8
VPP Specifications for One-Time Programmable (OTP) eFuses
This section specifies the operating conditions required for programming the OTP eFuses and is
applicable only for High-Security Devices.
Table 5-11. Recommended Operating Conditions for OTP eFuse Programming
over operating free-air temperature range (unless otherwise noted)
PARAMETER
DESCRIPTION
MIN
NOM
MAX
UNIT
VDD_CORE
Supply voltage range for the core domain
during OTP operation; OPP NOM (BOOT)
See Section 5.4
V
VDD_MCU
Supply voltage range for the core domain
during OTP operation; OPP NOM (BOOT)
See Section 5.4
V
VPP_CORE
Supply voltage range for the eFuse ROM
domain during normal operation
N/A
Supply voltage range for the eFuse ROM
domain during OTP programming (1)
1.71
1.8
1.89
V



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