FEDL2201-01

1Semiconductor

ML2201–XXX

19/20

PACKAGE DIMENSIONS

Notes for Mounting the Surface Mount Type Packages

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product

name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

SSOP8-P-44-0.65-K

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (

≥5µm)

0.044 TYP.

1/May.12,1999

(Unit: mm)