ADCLK950

Data Sheet

Rev. B | Page 12 of 12

OUTLINE DIMENSIONS

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

40

11

20

21

30

31

10

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.23

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

3.05

2.90 SQ

2.75

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-2.

4.50 REF

Figure 24. 40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.75 mm Package Height

(CP-40-16)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADCLK950BCPZ

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-16

ADCLK950BCPZ-REEL7

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-16

ADCLK950/PCBZ

Evaluation Board

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D08279-0-8/16(B)