LADLD15G-SH2-R datasheet(4/8 Pages) UTC

4 / 8 page

LXXLD15

Preliminary

CMOS IC

UNISONICTECHNOLOGIESCO.,LTD

4 of 8

www.unisonic.com.tw

QW-R502-638.c



ABSOLUTE MAXIMUM RATING

PARAMETER

SYMBOL

RATINGS

UNIT

Supply Voltage (VCNTL to GND)

VCNTL

-0.3 ~ +7

Supply Voltage (VIN to GND)

VIN

-0.3 ~ +3.9

EN and FB to GND

VI/O

-0.3 ~ VCNTL+0.3

POK to GND

VPOK

-0.3 ~ +7

Power Dissipation

2.8

Lead Soldering Temperature, 10 Seconds

TSDR

260

°С

Junction Temperature

150

°С

Storage Temperature

TSTG

-65 ~ +150

°С

Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.

Absolute maximum ratings are stress ratings only and functional device operation is not implied.



RECOMMENDED OPERATING CONDITIONS

PARAMETER

SYMBOL

RATINGS

UNIT

Supply Voltage

Control

VCNTL

3.1 ~ 6

Supply Voltage

Input

VIN

1.1 ~ 3.5

Output Voltage

VCNTL=3.3±5%

VOUT

0.8 ~ 1.2

VCNTL=5.0±5%

0.8 ~ VIN-0.2

Output Current

IOUT

0 ~ 1.5

Junction Temperature

-40 ~ +125

°С



THERMAL CHARACTERISTICS

PARAMETER

SYMBOL

RATINGS

UNIT

Junction to Ambient in Free Air (Note 1)

θJA

°C/W

Junction to Case (Note 2)

θJC

°C/W

Notes: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.

The exposed pad of HSOP-8 is soldered directly on the PCB.

2. The Thermal Pad Temperature is measured on the PCB copper area connected to the thermal pad of

package.

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