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AD8123ACPZ-R7 Datasheet(PDF) 6 Page - Analog Devices

No. de pieza AD8123ACPZ-R7
Descripción Electrónicos  Triple Differential Receiver with Adjustable Line Equalization
PDF  16 Pages
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

AD8123ACPZ-R7 Datasheet(HTML) 6 Page - Analog Devices

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AD8123
Data Sheet
Rev. B | Page 6 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
NIC
+INCMP1
OUTCMP1
VS+_CMP
VS–
VS+
VOFFSET
GND
VPOLE
VPEAK
VGAIN
–INCMP1
OUTCMP2
–INCMP2
+INCMP2
NIC
VS–_CMP
NIC
PD
NIC
1
2
3
4
5
6
7
8
9
10
23
24
25
26
27
28
29
30
22
21
TOP VIEW
(Not to Scale)
AD8123
2
NOTES
1. NIC = NO INTERNAL CONNECTION.
2. EXPOSED PADDLE ON THE BOTTOM OF THE PACKAGE
MUST BE CONNECTED TO A PCB PLANE TO ACHIEVE
SPECIFIED THERMAL RESISTANCE.
Figure 4. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1, 10, 20, 21, 30, 40
NIC
No Internal Connection.
2
+INCMP1
Positive Input, Comparator 1.
3
−INCMP1
Negative Input, Comparator 1.
4
OUTCMP1
Output, Comparator 1.
5
VS+_CMP
Positive Power Supply, Comparator. Must be connected to VS+.
6
OUTCMP2
Output, Comparator 2.
7
−INCMP2
Negative Input, Comparator 2.
8
+INCMP2
Positive Input, Comparator 2.
9
VS−_CMP
Negative Power Supply, Comparator. Must be connected to VS−.
11, 14, 17, 22, 33
VS−
Negative Power Supply, Equalizer Sections.
12
OUTB
Output, Blue Channel.
13, 16, 19, 29, 36
VS+
Positive Power Supply, Equalizer Sections.
15
OUTG
Output, Green Channel.
18
OUTR
Output, Red Channel.
23
VOFFSET
Output Offset Control Voltage.
24, 39
GND
Signal Ground Reference.
25
VGAIN
Broadband Flat Gain Control Voltage.
26
VPEAK
Equalizer High Frequency Boost Control Voltage.
27
VPOLE
Equalizer Pole Location Adjustment Control Voltage.
28
PD
Power Down.
31
+INR
Positive Input, Red Channel.
32
−INR
Negative Input, Red Channel.
34
+ING
Positive Input, Green Channel.
35
−ING
Negative Input, Green Channel.
37
+INB
Positive Input, Blue Channel.
38
−INB
Negative Input, Blue Channel.
EPAD
Exposed Paddle. Exposed paddle on the bottom of the package must be connected to a
PCB plane to achieve specified thermal resistance.



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