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CMP82C55AZ Datasheet(PDF) 25 Page - Renesas Technology Corp

No. de pieza CMP82C55AZ
Descripción Electrónicos  CMOS Programmable Peripheral Interface
PDF  26 Pages
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Fabricante Electrónico  RENESAS [Renesas Technology Corp]
Página de inicio  http://www.renesas.com
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CMP82C55AZ Datasheet(HTML) 25 Page - Renesas Technology Corp

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MS82C55A, MQ82C55A, MP82C55A
FN6140 Rev 2.00
Page 25 of 26
June 15, 2006
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
CL
N44.65 (JEDEC MS-018AC ISSUE A)
44 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.685
0.695
17.40
17.65
-
D1
0.650
0.656
16.51
16.66
3
D2
0.291
0.319
7.40
8.10
4, 5
E
0.685
0.695
17.40
17.65
-
E1
0.650
0.656
16.51
16.66
3
E2
0.291
0.319
7.40
8.10
4, 5
N44
44
6
Rev. 2 11/97



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