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AD8317ACPZ-R2 Datasheet(PDF) 19 Page - Analog Devices |
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AD8317ACPZ-R2 Datasheet(HTML) 19 Page - Analog Devices |
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19 / 19 page ![]() Data Sheet AD8317 Rev. C | Page 19 of 19 OUTLINE DIMENSIONS SEATING PLANE 0.30 0.23 0.18 0.203 REF 0.80 0.75 0.70 1.89 1.74 1.59 0.50 BSC 0.20 MIN 0.60 0.45 0.30 0.55 0.40 0.30 BOTTOM VIEW 4 1 5 8 3.25 3.00 2.75 2.25 2.00 1.75 TOP VIEW 0.05 MAX 0.02 NOM EXPOSED PAD PIN 1 INDEX AREA FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) DETAIL A (JEDEC 95) Figure 40. 8-Lead Lead Frame Chip Scale Package [LFCSP] 2 mm × 3 mm Body and 0.75 mm Package Height (CP-8-23) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option Branding AD8317ACPZ-R7 −40°C to +85°C 8-Lead LFCSP, 7”Tape and Reel CP-8-23 Q1 AD8317ACPZ-R2 −40°C to +85°C 8-Lead LFCSP, 7”Tape and Reel CP-8-23 Q1 AD8317ACPZ-WP −40°C to +85°C 8-Lead LFCSP, Waffle Pack CP-8-23 Q1 AD8317ACHIPS −40°C to +85°C Die AD8317-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. ©2005–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05541-0-8/17(C) |
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