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MP2625BGL Datasheet(PDF) 5 Page - Monolithic Power Systems

No. de pieza MP2625BGL
Descripción Electrónicos  2A Switching Charger with NVDC Power Path Management For Single Cell Li Battery
PDF  31 Pages
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Fabricante Electrónico  MPS [Monolithic Power Systems]
Página de inicio  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP2625BGL Datasheet(HTML) 5 Page - Monolithic Power Systems

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MP2625B – SINGLE CELL SWITCHING CHARGER WITH POWER PATH CONTROL
MP2625B Rev. 1.01
www.MonolithicPower.com
5
1/15/2018
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2018 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS
(1)
IN, SW .........................................-0.3V to +20V
BATT, SYS .....................................-0.3V to +6V
BST...............................................-0.3V to +26V
All Other Pins..................................-0.3V to +6V
Continuous Power Dissipation (TA = +25°C)
(2)
QFN20 3mmx4mm..................................... 2.6W
Junction Temperature...............................150
C
Lead Temperature ....................................260
C
Storage Temperature.................–65°C to 150°C
Recommended Operating Conditions
(3)
Supply Voltage VIN ...........................4.0V to 10V
Operating Junction Temp. (TJ).... -40°C to +125°C
Thermal Resistance
(4)
θJA
θJC
QFN-20 (3mmx4mm).............. 48 ...... 11...
C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.



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