HA17358/A Series

7

Solder Mounting Method

1. Small and light surface-mount packages require spicial attentions on solder mounting.

On solder mounting, pre-heating before soldering is needed.

The following figure show an example of infrared rays refow.

2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a

failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress.

Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic

substrates.

140 to 160

°C

1 to 5

°C/s

235

°C Max

10 s Max

1 to 4

°C/s

Time (s)

≅ 60 s

Figure 1 An Example of Infrared Rays Reflow Conditions