LTC7000 datasheet(21/28 Pages) LINER

21 / 28 page

LTC7000/LTC7000-1

7000fa

For more information www.linear.com/LTC7000

applicaTions inForMaTion

PC Board Layout Considerations

1. Solder the exposed pad on the backside of the LTC7000/

LTC7000-1 packages directly to the ground plane of the

board.

2. Kelvin connect current sense resistor.

3. Limit the resistance of the TS trace, by making it short

and wide.

4. CB needs to be close to chip.

5. Always include an option in the PC board layout to

place a resistor in series with the gate of any exter-

nal MOSFET. High frequency oscillations are design

dependent and having the option to add a series damp-

ening resistor can save a design iteration of the PC

board.

Pin Creepage and Clearance

In some higher voltage applications, the MSE16 package

may not provide sufficient PC board trace clearance

between high and low voltage pins. In applications where

clearance is required, the LTC7000-1 in the MSE16(12)

package can be used. The MSE16(12) package has

removed pins between all the adjacent high voltage

and low voltage pins, providing 0.657mm clearance,

which will be sufficient for most applications. For more

information, refer to the printed circuit board design

standards described in IPC-2221 (www.ipc.org).

LTC7000 Datasheet(PDF) 21 Page - Linear Technology