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MP8758HGL Datasheet(PDF) 3 Page - Monolithic Power Systems |
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MP8758HGL Datasheet(HTML) 3 Page - Monolithic Power Systems |
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3 / 23 page ![]() MP8758H–22V, HIGH-CURRENT SYNCHRONOUS BUCK CONVERTER MP8758H Rev.1.0 www.MonolithicPower.com 3 10/13/2015 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2015 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) Supply voltage (VIN) ..................................... 24V VSW...............................................-0.3V to 24.3V VSW (30ns)..........................................-3V to 28V VSW (5ns)............................................-6V to 28V VBST ................................................... VSW + 5.5V VEN ............................................................... 12V Enable current (IEN) (2)............................... 2.5mA All other pins ................................-0.3V to +5.5V Continuous power dissipation (TA=+25°C) (3) QFN-21 (3mmx4mm). ................................ 2.5W Junction temperature ................................150 °C Lead temperature .....................................260 °C Storage temperature................ -65 °C to +150°C Recommended Operating Conditions (4) Supply voltage (VIN) .........................4.5V to 22V Output voltage (VOUT).......................................... 0.604V to VINxDMAX or 5.5V Enable current (IEN)..................................... 1mA Operating junction temp. (TJ). .. -40°C to +125°C Thermal Resistance (5) θJA θJC QFN-21 (3mmx4mm) ..............50 ...... 12 ... °C/W NOTES: 1) Exceeding these ratings may damage the device. 2) For details on EN’s ABS MAX rating, please refer to the “EN Control section on page 14. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ(MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. |
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