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MP4569 Datasheet(PDF) 13 Page - Monolithic Power Systems

No. de pieza MP4569
Descripción Electrónicos  75V, 0.3A Synchronous Step-Down Converter
PDF  17 Pages
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Fabricante Electrónico  MPS [Monolithic Power Systems]
Página de inicio  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP4569 Datasheet(HTML) 13 Page - Monolithic Power Systems

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MP4569―75V, 0.3A, SYNCHRONOUS STEP-DOWN CONVERTER
MP4569 Rev. 1.0
www.MonolithicPower.com
13
9/12/2014
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2014 MPS. All Rights Reserved.
The UVLO threshold can be computed from
below two equations.
TH_Rising
) EN
3M//R2
R1
(1
UVLO
TH_Rising
×
+
=
TH_Falling
) EN
3M//R2
R1
(1
UVLO
TH_Falling
×
+
=
Soft Start Capacitor
The soft start time is the duration when SS is
charged from 0 to FB reference voltage 1V by an
internal 5μA current source. So the capacitor at
SS pin can be chosen according to below
formula:
F)
μ
(
t
C
SS
SS
×
= 5
Feed-Forward Capacitor
As described above that the PWM control
scheme of MP4569 is very special and the
HS_FET turns on when FB drops lower than
reference voltage. This brings good load
transient performance. However, this also makes
the HS_FET turn on moment is very sensitive to
the FB voltage. Once there is noise on FB, the
moment HS_FET turns on is easy to be affected,
and then Fsw jitter would occur. The Fsw jitter is
easy to happen especially when Vo ripple is very
small. To improve the jitter performance, a small
feedforward capacitor between Vo and FB can
be used and typical 39pF is recommended.
PCB Layout
PCB layout is very important to achieve stable
operation. Please follow below guidelines and
use Figure 5 as reference.
1) Keep the path of switching current short and
minimize the loop area formed by input
capacitor, high-side, low-side MOSFET and
output capacitor.
2) Bypass ceramic capacitors should be as
close as possible to the VIN pin.
3) Make sure that all feedback connections are
short and direct. Place the feedback resistors
as close to the chip as possible.
4) Keep SW away from sensitive analog areas
such as FB.
5) For better thermal performance and long-term
reliability consideration, VIN, SW and GND
should be connected to a large copper area
respectively to cool the chip.
Top Layer
Bottom Layer
(a) Layout Reference of QFN-10 Package(7)



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