| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
 Amkor Technology |
WLCSP+
|
1Mb / 5P |
Wafer level packaging applies similar processes as used in front-end wafer processing.
01/22 |
|
WLCSP-V01
|
813Kb / 3P |
Wafer Level Processing & Die Processing Services (WLP/DPS)
01/22 |
 Global Mixed-mode Techn... |
WLCSP11X12-132
|
165Kb / 1P |
Package Outline
|
|
WLCSP15X15-163
|
173Kb / 1P |
Package Outline
|
 NXP Semiconductors |
WLCSP16
|
255Kb / 38P |
32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 8 kB SRAM
Rev. 00.04-23 June 2010 |