FEATURES
● Batch process design, excellent power dissipation offers batter reverse leakage current and thermal resistance.
● Low profile surface mounted application in order to optimize board space.
● Tiny plastic SMD package.
● High current capability.
● Fast switching for high efficiency.
● High surge current capability.
● Glass passivated chip junction.
● Lead-free parts meet RoHS requirements.
● Suffix “-H” indicates Halogen-free parts, ex. SMF101MH-H