| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd. |
0879202003
|
1Mb / 16P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap, without Peg
|
|
0879200830
|
1Mb / 12P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
|
|
0879200833
|
1Mb / 16P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap, without Peg
|
|
0879208115
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
|
|
0015912140
|
1Mb / 8P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
|
|
0879208147
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tube Packaging
|
|
0879209346
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 34 Circuits, Tin (Sn) Overall Plating, without Cap, without Peg, Tube Packaging, Lead-free
|
|
15-91-1141
|
35Kb / 2P |
2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Plating, with 3.30mm PCB Locator Pegs
|
|
0015911141
|
1Mb / 8P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Plating, with 3.30mm (.130) PCB Locator Pegs
|
|
0713492005
|
432Kb / 5P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, Shrouded,14 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
|
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