Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Molex Electronics Ltd. |
0877593864
|
432Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 38 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
|
0877593074
|
432Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
|
0877594474
|
432Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 44 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap
|
0877590465
|
292Kb / 6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
|
0877593274
|
432Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 32 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap
|
0877594274
|
432Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
|
0877590474
|
432Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
|
0877594074
|
431Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 40 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
|
0877592474
|
432Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
|
0877592074
|
432Kb / 8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging
|