High aspect ratio, straight fin heat sinks that are ideal for
compact PCB environments
maxiGRIP™ attachment applies steady, even pressure to
the component and does not require holes in the PCB
Designed specifically for BGAs and other surface mount
packages
Meets Telcordia GR-63-Core Office Vibration; ETSI 300
019 Transportation Vibration; and MIL-STD-810 Shock
Testing and Unpackaged Drop Testing standards
Comes preassembled with high performance, phase
changing, thermal interface material